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Physical and Chemical Methods: A Review on the Analysis of Deposition Parameters of Thin Film Preparation Methods |
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PP: 59-66 |
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doi:10.18576/ijtfst/130107
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Author(s) |
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T. Nimalan,
M. R. Begam,
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Abstract |
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| The purpose of this review article is to explain an analysis of the various thin film deposition parameters. A thin film is a very thin and useful layer with a thickness of a few nanometers to several micrometers. The process of forming thin films is known as deposition. There are many physical and chemical deposition methods available. This review paper elaborates on the various deposition methods and conditions such as thermal evaporation, electron beam evaporation, molecular-beam epitaxy, sputtering processes, chemical vapor deposition, sol-gel and spray pyrolysis technique etc., and the advantages and disadvantages of each method. Thin film materials are used in a wide variety of applications such as integrated circuits, semiconductor devices, protective glasses, photo conductors, switches, solar cells, superconducting switches, sensors, memories, hard coatings etc., From our review work, the various deposition parameters are analyzed it is clear that chemical methods are the most important methods for depositing thin films and producing high quality films at low cost.
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