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Revealing the role of vacuum chamber parameters on the pathways leading to substrate deposition by ejected atoms |
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PP: 159-162 |
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doi:10.18576/ijtfst/120301
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Author(s) |
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Abdelkader BOUAZZA,
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Abstract |
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| The simulation with Monte-Carlo codes represented the efficiency tools that help understand the phenomena inside the vacuum chamber for sputtering. In this work, the impact of temperature and pressure parameters on the surface structure of thin films is studied in 3D with the magnetron sputtering technique. Inside a vacuum chamber, 105 particles of Argon (Ar) gas are injected, the target contains the semi-conductor silicon (Si), and the substrate is placed at a variable distance from the target. The results of this work show that a high temperature, pressure, and long distance between the target and substrate can negatively affect the path of the atoms ejected away from the target, which will cause a decrease in the number of atoms arriving on the substrate.
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