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Resistivity of Bilayers Ni/Pd Films and Ni1-xPdx Alloys Films |
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PP: 75-79 |
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doi:10.18576/ijtfst/100111
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Author(s) |
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M. K. Loudjani,
C. Sella,
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Abstract |
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| In this study, we present the resistivity measurements on pure metal films Ni, Pd, on binary alloys films Ni1-xPdx and on bilayers Ni/Pd films. We will analyze the effect of disorder related to the random distribution of elements in solid solution on the alloy Ni1-xPdx film resistivity. We used two types of substrates: glass-Corning and a polycrystalline a- alumina. The resistivity Ni1-xPdx alloy films at ambient temperature presents two maxima, one maximum near atomic composition Ni72Pd28 and the other near Ni30Pd70. The resistivities of Ni1-xPdx films deposited on the a-alumina substrates are 30% larger than the resistivities of the Ni1-xPdx films deposited on the glass-Corning substrates. When one changes the degree of order in the mixture (Ni, Pd) while passing from a solid solution NixPd1-x to bilayers Ni/Pd films, the apparent resistivity decreases by a factor larger than 2.
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